| 1. 聚合物-金属复合材料研究 |
| 聚合物-金属复合材料是现代电子产业中的核心与关键材料,是国家‘十五五’规划的重点发展领域,在消费电子(如智能手机等)中起到导电互连、芯片封装、散热、密封等关键作用。团队主要研究高分子与金属复合工艺、金属分布结构调控以及复合界面问题等,致力于金属与高分子的学科交叉研究,联系金属的相变、凝固、流变理论,结合高分子流变、相变等学科体系,实现复合材料在电子领域的广泛应用。本方向将涉及高分子物理与高分子加工方面的知识,同时联系金属的相变、凝固、流变学科知识,致力于揭示复合材料结构-性能方面的理论关系,开发新一代聚合物基的精细电子化工材料。 |
| 2. 高分子复合材料与电子信息学科的交叉研究 |
电子信息材料是国家战略新兴产业的关键。团队重点对准国家战略与市场核心需求,
以“电子封装、电子化工材料及柔性电子器件”为主要研究方向;探索高分子复合材料和电子信息学科交叉,研究聚合物-金属/碳等复合材料在高密度互连电子封装、柔性电子集成、电子信息材料制造等领域的应用,涉及电子信息材料设计制造、结构表征、性能测试等各个环节。本方向将涉及聚合物复合材料、电子封装、柔性电子、电子信息材料
等领域知识,将重点关注材料-电子信息的学科理论交叉研究,实现具有经济价值的新一代电子材料和电子器件。
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| 1. Polymer-Metal Composites |
| Polymer-metal composite materials are core and critical components in the modern electronics industry. They play essential roles in consumer electronics (such as smartphones), including electrical interconnection, chip packaging, heat dissipation, and sealing. Our research team focuses on the interfacial issues between polymers and metals, composite processing techniques, and the regulation of metal distribution structures. We are dedicated to interdisciplinary studies integrating metals and polymers, connecting theories of metal phase transformation, solidification, and rheology with polymer rheology, phase transition, and related disciplines to enable the broad application of composite materials in the electronics. This research direction involves knowledge of polymer chemistry, physics, and processing, while also integrating insights from metal phase transformation, solidification, and rheology. Our goal is to elucidate the theoretical relationships between structure and performance in composite materials for electronics. |
| 2. Interdisciplinary Study between Polymer Composites and Electronics |
| Electronic materials are pivotal to national strategic emerging industries. Our team aligns closely with national strategies and core market demands, focusing on “electronic packaging, electronic chemical materials, and flexible electronic devices” as primary research directions. We explore interdisciplinary integration between polymer composite materials and electronic information disciplines, investigating the applications of polymer-metal/carbon composites in high-density interconnected electronic packaging, flexible electronic integration, and electronic material manufacturing. This involves all stages of electronic information material design, manufacturing, structural characterization, and performance testing. This research direction encompasses knowledge in polymer composites, electronic packaging, flexible electronics, and electronic materials, with a strong emphasis on interdisciplinary theoretical studies bridging materials science and electronics to develop economically valuable next-generation electronic materials and devices. |
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